High Precision Aluminum Nitride DPC Ceramic Substrate

High Precision Aluminum Nitride DPC Ceramic SubstrateProduct Specifications: Material: Aluminum Nitride Ceramic Thickness: 0.38 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Tolerance: ±0.05 Warp: 0.003 mm/mm Key Highlights: Direct Plating Copper technology ensures high-precision graphic patterns and vertical circuit interconnections, ideal for dense packaging in optical communication devices; Exceptional thermal conductivity aids rapid heat dissipation during high-speed data transmission; High electrical insulation and thermal stability reduce failure rates in high-end laser and optical communication applications. Application Areas: High-speed optical communication modules Precision laser equipment Dense electronic packaging systems Keywords: Aluminum Nitride Ceramic Substrate, vertical interconnect, DPC substrate, optical communication, laser systems, Direct Plating Copper

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Product Details

High Precision Aluminum Nitride DPC Ceramic Substrate
Product Specifications:

- - Material: Aluminum Nitride Ceramic
  - Thickness: 0.38 mm
  - Graphic Tolerance: ±0.03 mm
  - Product Size: 109.2×54.5 mm
  - Tolerance: ±0.05
  - Warp: 0.003 mm/mm

Key Highlights:

- - Direct Plating Copper technology ensures high-precision graphic patterns and vertical circuit interconnections, ideal for dense packaging in optical communication devices;
  - Exceptional thermal conductivity aids rapid heat dissipation during high-speed data transmission;
  - High electrical insulation and thermal stability reduce failure rates in high-end laser and optical communication applications.