High Thermal Conductivity Aluminum Nitride DPC Ceramic Substrate

High Thermal Conductivity Aluminum Nitride DPC Ceramic SubstrateProduct Specifications: Material: Aluminum Nitride Ceramic Thickness: 0.38 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Tolerance: ±0.05 Warp: 0.003 mm/mm Key Features: Ceramic thermal conductivity exceeds 170, ensuring excellent heat transfer and rapid heat dissipation for stable operating temperatures; Manufactured with Direct Plating Copper technology, offering precise circuit patterns and vertical interconnections; High electrical insulation and a thermal expansion coefficient closely matching that of silicon enhance overall system reliability. Application Areas: LED lighting and display devices Laser systems and optical communication equipment Laser radar and high-temperature applications Keywords: Aluminum Nitride Ceramic Substrate, DPC Substrate, Direct Plating Copper, high thermal conductivity, LED substrate, laser substrate

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Product Details

High Thermal Conductivity Aluminum Nitride DPC Ceramic Substrate
Product Specifications:

- - Material: Aluminum Nitride Ceramic
  - Thickness: 0.38 mm
  - Graphic Tolerance: ±0.03 mm
  - Product Size: 109.2×54.5 mm
  - Tolerance: ±0.05
  - Warp: 0.003 mm/mm

Key Features:

- - Ceramic thermal conductivity exceeds 170, ensuring excellent heat transfer and rapid heat dissipation for stable operating temperatures;
  - Manufactured with Direct Plating Copper technology, offering precise circuit patterns and vertical interconnections;
  - High electrical insulation and a thermal expansion coefficient closely matching that of silicon enhance overall system reliability.