Alumina DPC ceramic substrate（Direct Plating Copper）

Alumina DPC ceramic substrate Direct Plating Copper Material: Alumina ceramic Thickness: 0.5 Toleranță grafică: ±0.03 Dimensiunea produsului: 109.2*54.5mm Tolerance: ±0.05 Warp (milimetru): 0.003/mm Features: Ceramic thermal conductivity>24, with high line accuracy, high surface flatness, high insulation and high thermal conductivity, low thermal expansion coefficient, circuits can be vertically interconnected LED, laser, optical communication, laser radar

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Detalii produs

Substrat ceramic DPC de alumină
Direct Plating Copper

Material: Alumina ceramic
Grosime: 0.5
Toleranță grafică: ±0,03
Dimensiunea produsului: 109.2*54.5milimetru
Tolerance: ±0.05
Warp (milimetru): 0.003/milimetru
Caracteristici: Ceramic thermal conductivity>24, with high line accuracy, high surface flatness, high insulation and high thermal conductivity, low thermal expansion coefficient, circuits can be vertically interconnected
LED, laser, optical communication, laser radar